Datasheet

MC9S12DT128B Device User Guide — V01.09
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics
1
NOTES:
1. The values for thermal resistance are achieved by package simulations
Num C Rating Symbol Min Typ Max Unit
1T
Thermal Resistance LQFP112, single sided PCB
2
2. PC Board according to EIA/JEDEC Standard 51-3
θ
JA
––54
o
C/W
2T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
3
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
––41
o
C/W
3 T Junction to Board LQFP112
θ
JB
––31
o
C/W
4 T Junction to Case LQFP112
θ
JC
––11
o
C/W
5 T Junction to Package Top LQFP112
Ψ
JT
––2
o
C/W
6 T Thermal Resistance QFP 80, single sided PCB
θ
JA
––51
o
C/W
7T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ
JA
––41
o
C/W
8 T Junction to Board QFP80
θ
JB
––27
o
C/W
9 T Junction to Case QFP80
θ
JC
––14
o
C/W
10 T Junction to Package Top QFP80
Ψ
JT
––3
o
C/W
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