Datasheet

MC9S12E256 Data Sheet, Rev. 1.10
Freescale Semiconductor 606
Appendix B
Ordering Information and Mechanical Drawings
Figure B-1. Order Part Number Coding
Table B-1 lists the part number coding based on the package and temperature.
Table B-2 summarizes the package option and size configuration.
Table B-1. Part Number Coding
Part Number Temperature Package
MC9S12E256CFU -40˚C, 85˚C 80 QFP
MC9S12E256CPV -40˚C, 85˚C 112 LQFP
MC9S12E256MFU -40˚C, 125˚C 80 QFP
MC9S12E256MPV -40˚C, 125˚C 112 LQFP
Table B-2. Package Option Summary
Part
Number
Package
Temp.
1
Options
1
C: T
A
= 85¯C, f = 25MHz. M: T
A
= 125¯C, f = 25MHz
Flash RAM MEBI TIM SCI SPI IIC A/D D/A PWM PMF KWU I/O
2
2
I/O is the sum of ports capable to act as digital input or output.
TIM is the number of channels.
A/D is the number of A/D channels.
D/A is the number of D/A channels.
PWM is the number of channels.
PMF is the number of channels.
KWU is the number of key wake up interrupt pins.
I/O is the sum of ports capable to act as digital input or output.
MC9S12E256
112LQFP
M, C 256K 16K
1
12 3 1 1 16 2 6 6 16
92
80QFP 0 60
MC9S12 E256 C FU
Package Option
Temperature Option
Device Title
Controller Family
Temperature Options
Package Options
FU = 80 QFP
PV = 112 LQFP
C = –40˚C to 85˚C
V = –40˚C to 105˚C
M = –40˚C to 125˚C