Datasheet

Appendix A Electrical Characteristics
MC9S12E128 Data Sheet, Rev. 1.07
Freescale Semiconductor 567
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE
Instead of specifying ambient temperature all parameters are specified for
the more meaningful silicon junction temperature. For power dissipation
calculations refer to Section A.1.8, “Power Dissipation and Thermal
Characteristics”.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
) in °C can be
obtained from:
The total power dissipation can be calculated from:
Table A-4. Operating Conditions
Rating Symbol Min Typ Max Unit
I/O, Regulator and Analog Supply Voltage V
DD5
2.97 3.3/5 5.5 V
Internal Logic Supply Voltage
1
1
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The given
operating range applies when this regulator is disabled and the device is powered from an external source.
V
DD
2.35 2.5 2.75 V
PLL Supply Voltage
1
V
DDPLL
2.35 2.5 2.75 V
Voltage Difference VDDX to VDDA ∆
VDDX
–0.1 0 0.1 V
Voltage Difference VSSX to VSSR and VSSA ∆
VSSX
–0.1 0 0.1 V
Oscillator f
osc
0.5 — 16 MHz
Bus Frequency
2
2
Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
f
bus
0.25 — 25 MHz
Operating Junction Temperature Range T
J
–40 — 140 °C
T
J
T
A
P
D
Θ
JA
•()+=
T
J
Junction Temperature, [°C ]=
T
A
Ambient Temperature, [°C ]=
P
D
Total Chip Power Dissipation, [W]=
Θ
JA
Package Thermal Resistance, [°C/W]=
P
D
P
INT
P
IO
+=
P
INT
Chip Internal Power Dissipation, [W]=