Datasheet

Appendix B Package Information
MC9S12E128 Data Sheet, Rev. 1.07
600 Freescale Semiconductor
B.2 80-Pin QFP Package
Figure B-2. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
SECTION B-B
61
60
DETAIL A
L
41
40
80
-A-
L
-D-
A
S
A-B
M
0.20 D
S
H
0.05
A-B
S
120
21
-B-
B
V
J
F
N
D
VIEW ROTATED 90
°
DETAIL A
B
B
P
-A-,-B-,-D-
E
H
G
M
M
DETAIL C
SEATING
PLANE
-C-
C DATUM
PLANE
0.10
-H-
DATUM
PLANE
-H-
U
T
R
Q
K
W
X
DETAIL C
DIM MIN MAX
MILLIMETERS
A 13.90 14.10
B 13.90 14.10
C 2.15 2.45
D 0.22 0.38
E 2.00 2.40
F 0.22 0.33
G 0.65 BSC
H --- 0.25
J 0.13 0.23
K 0.65 0.95
L 12.35 REF
M 510
N 0.13 0.17
P 0.325 BSC
Q 07
R 0.13 0.30
S 16.95 17.45
T 0.13 ---
U 0 ---
V 16.95 17.45
W 0.35 0.45
X 1.6 REF
°°
°°
°
S
A-B
M
0.20 D
S
C
S
A-B
M
0.20 D
S
H
0.05 D
S
A-B
M
0.20 D
S
C
S
A-B
M
0.20 D
S
C