Datasheet

Appendix B Package Information
MC9S12XE-Family Reference Manual Rev. 1.25
Freescale Semiconductor 1259
B.1 208 MAPBGA
Figure B-1. 208MAPBGA Mechanical Dimensions
B.2 144-Pin LQFP
K
M
M
E
D
0.2
4X
X
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
12345678910111213141516
15X e
X
S
0.3
M
YXZ
0.1
M
Z
208X b
3
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
15X e
S
VIEW M M
VIEW K
(ROTATED 90° CLOCKWISE)
0.2 Z
5
0.2
208X
Z
Z
4
A
A1
A2
CASE 1159A-01
ISSUE B
DATE 12/12/98
DIM MIN MAX
MILLIMETERS
A --- 2.00
A1 0.40 0.60
A2 1.00 1.30
b 0.50 0.70
D 17.00 BSC
E 17.00 BSC
e 1.00 BSC
S 0.50 BSC
NOTES:
1.
2.
3.
4.
5.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.