Datasheet

Electrical Characteristics
S12XS Family Reference Manual, Rev. 1.13
662 Freescale Semiconductor
NOTE
Using the internal voltage regulator, operation is guaranteed in a power
down until a low voltage reset assertion.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
) in °C can be
obtained from:
Voltage difference V
DDR
to V
DDX
∆
VDDR
-0.1 0 0.1 V
Voltage difference V
SSX
to V
SSA
∆
VSSX
refer to Table A-14
Voltage difference V
SS1
, V
SS2
, V
SS3
, V
SSPLL
to V
SSX
∆
VSS
-0.1 0 0.1 V
Digital logic supply voltage
1
V
DD
1.72 1.8 1.98 V
PLL supply voltage V
DDPLL
1.72 1.8 1.98 V
Oscillator
2
(Loop Controlled Pierce)
(Full Swing Pierce)
f
osc
4
2
—
—
16
40
MHz
Bus frequency
3
f
bus
0.5 — 40 MHz
Temperature Option C
Operating junction temperature range
Operating ambient temperature range
4
T
J
T
A
–40
–40
—
27
110
85
°C
Temperature Option V
Operating junction temperature range
Operating ambient temperature range
4
T
J
T
A
–40
–40
—
27
130
105
°C
Temperature Option M
Operating junction temperature range
Operating ambient temperature range
4
T
J
T
A
–40
–40
—
27
150
125
°C
1
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply.
2
This refers to the oscillator base frequency. Typical crystal & resonator tolerances are supported.
3
Please refer to Table A-24 for maximum bus frequency limits with frequency modulation enabled
4
Please refer to Section A.1.8, “Power Dissipation and Thermal Characteristics” for more details about the relation between
ambient temperature T
A
and device junction temperature T
J
.
Table A-4. Operating Conditions
T
J
T
A
P
D
Θ
JA
•()+=
T
J
Junction Temperature, [°C ]=
T
A
Ambient Temperature, [°C ]=
P
D
Total Chip Power Dissipation, [W]=
Θ
JA
Package Thermal Resistance, [°C/W]=