Datasheet

MCF5213 ColdFire Microcontroller, Rev. 3
Electrical Characteristics
Freescale Semiconductor28
2.3 Thermal Characteristics
Table 22 lists thermal resistance values.
Table 21. Typical Active Current Consumption Specifications
Characteristic Symbol
Typical
1
Active
(SRAM)
1
Tested at room temperature with CPU polling a status register. All clocks were off except the UART and CFM (when
running from flash memory).
Typical
1
Active
(Flash)
Peak
2
2
Peak current measured with all modules active, and default drive strength with matching load.
Unit
1 MHz core & I/O I
DD
—3.48—mA
8 MHz core & I/O 7.28 13.37 19.02
16 MHz core & I/O 12.08 25.08 35.66
64 MHz core & I/O 40.14 54.62 85.01
80 MHz core & I/O 49.2 64.09 100.03
RAM standby supply current
• Normal operation: V
DD
> V
STBY
- 0.3 V
• Transient condition: V
STBY
- 0.3 V > V
DD
> V
SS
+ 0.5 V
• Standby operation: V
DD
< V
SS
+ 0.5 V
I
STBY
N/A
3
N/A
3
N/A
3
3
Due to the errata “Non-functional RAM Standby Supply” in the MCF5213 Device Errata, V
STBY
should be connected
directly to V
DD
and cannot be used for RAM standby operation.
N/A
3
N/A
3
N/A
3
μA
mA
μA
Analog supply current
• Normal operation
• Low-power stop
I
DDA
—
—
—
—
16
50
mA
μA
Table 22. Thermal Characteristics
Characteristic Symbol Value Unit
100 LQFP Junction to ambient, natural convection Single layer board (1s) θ
JA
53
1,2
°C / W
Junction to ambient, natural convection Four layer board (2s2p) θ
JA
39
1,3
°C / W
Junction to ambient, (@200 ft/min) Single layer board (1s) θ
JMA
42
1,3
°C / W
Junction to ambient, (@200 ft/min) Four layer board (2s2p) θ
JMA
33
1,3
°C / W
Junction to board — θ
JB
25
4
°C / W
Junction to case — θ
JC
9
5
°C / W
Junction to top of package Natural convection Ψ
jt
2
6
°C / W
Maximum operating junction temperature — T
j
105
o
C