Datasheet

xxxii MCF5307 User’s Manual
Organization
— Chapter 4, “Local Memory.” This chapter describes the MCF5307
implementation of the ColdFire V3 local memory specification. It consists of the
two following major sections.
– Section 4.2, “SRAM Overview,” describes the MCF5307 on-chip static RAM
(SRAM) implementation. It covers general operations, configuration, and
initialization. It also provides information and examples showing how to
minimize power consumption when using the SRAM.
– Section 4.7, “Cache Overview,” describes the MCF5307 cache
implementation, including organization, configuration, and coherency. It
describes cache operations and how the cache interacts with other memory
structures.
— Chapter 5, “Debug Support,” describes the Revision C enhanced hardware debug
support in the MCF5307. This revision of the ColdFire debug architecture
encompasses earlier revisions.
• Part II, “System Integration Module (SIM),” describes the system integration
module, which provides overall control of the bus and serves as the interface
between the ColdFire core processor complex and internal peripheral devices. It
includes a general description of the SIM and individual chapters that describe
components of the SIM, such as the phase-lock loop (PLL) timing source, interrupt
controller for peripherals, configuration and operation of chip selects, and the
SDRAM controller.
— Chapter 6, “SIM Overview,” describes the SIM programming model, bus
arbitration, and system-protection functions for the MCF5307.
— Chapter 7, “Phase-Locked Loop (PLL),” describes configuration and operation
of the PLL module. It describes in detail the registers and signals that support the
PLL implementation.
— Chapter 8, “I
2
C Module,” describes the MCF5307 I
2
C module, including I
2
C
protocol, clock synchronization, and the registers in the I
2
C programing model.
It also provides extensive programming examples.
— Chapter 9, “Interrupt Controller,” describes operation of the interrupt controller
portion of the SIM. Includes descriptions of the registers in the interrupt
controller memory map and the interrupt priority scheme.
— Chapter 10, “Chip-Select Module,” describes the MCF5307 chip-select
implementation, including the operation and programming model, which
includes the chip-select address, mask, and control registers.
— Chapter 11, “Synchronous/Asynchronous DRAM Controller Module,”
describes configuration and operation of the synchronous/asynchronous DRAM
controller component of the SIM. It begins with a general description and brief
glossary, and includes a description of signals involved in DRAM operations.
The remainder of the chapter is divided between descriptions of asynchronous
and synchronous operations.
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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