Datasheet

Chapter 1. Overview 1-1
Chapter 1
Overview
This chapter is an overview of the MCF5307 ColdFire processor. It includes general
descriptions of the modules and features incorporated in the MCF5307.
1.1 Features
The MCF5307 integrated microprocessor combines a V3 ColdFire processor core with the
following components, as shown in Figure 1-1:
• 8-Kbyte unified cache
• 4-Kbyte on-chip SRAM
• Integer/fractional multiply-accumulate (MAC) unit
• Divide unit
• System debug interface
• DRAM controller for synchronous and asynchronous DRAM
• Four-channel DMA controller
• Two general-purpose timers
•Two UARTs
•I
2
C™ interface
• Parallel I/O interface
• System integration module (SIM)
Designed for embedded control applications, the MCF5307 delivers 75 Dhrystone 2.1
MIPS at 90 MHz while minimizing system costs.
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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