Datasheet

CONTENTS
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Contents v
About This Book
Chapter 1
Overview
1.1 Features............................................................................................................... 1-1
1.2 MCF5307 Features.............................................................................................. 1-4
1.2.1 Process ............................................................................................................ 1-6
1.3 ColdFire Module Description ............................................................................. 1-7
1.3.1 ColdFire Core ................................................................................................. 1-7
1.3.1.1 Instruction Fetch Pipeline (IFP).................................................................. 1-7
1.3.1.2 Operand Execution Pipeline (OEP)............................................................ 1-7
1.3.1.3 MAC Module.............................................................................................. 1-7
1.3.1.4 Integer Divide Module................................................................................ 1-7
1.3.1.5 8-Kbyte Unified Cache............................................................................... 1-8
1.3.1.6 Internal 4-Kbyte SRAM ............................................................................. 1-8
1.3.2 DRAM Controller........................................................................................... 1-8
1.3.3 DMA Controller.............................................................................................. 1-8
1.3.4 UART Modules............................................................................................... 1-8
1.3.5 Timer Module ................................................................................................. 1-9
1.3.6 I2C Module..................................................................................................... 1-9
1.3.7 System Interface ........................................................................................... 1-10
1.3.7.1 External Bus Interface .............................................................................. 1-10
1.3.7.2 Chip Selects .............................................................................................. 1-10
1.3.7.3 16-Bit Parallel Port Interface.................................................................... 1-10
1.3.7.4 Interrupt Controller................................................................................... 1-10
1.3.7.5 JTAG......................................................................................................... 1-11
1.3.8 System Debug Interface................................................................................ 1-11
1.3.9 PLL Module.................................................................................................. 1-11
1.4 Programming Model, Addressing Modes, and Instruction Set......................... 1-12
1.4.1 Programming Model..................................................................................... 1-13
1.4.2 User Registers............................................................................................... 1-14
1.4.3 Supervisor Registers ..................................................................................... 1-14
1.4.4 Instruction Set............................................................................................... 1-15
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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