Datasheet
Table Of Contents
- MCF5441x ColdFire Microprocessor Data Sheet
- 1 MCF5441x family comparison
- 2 Hardware design considerations
- 3 Pin assignments and reset states
- 4 Electrical characteristics
- 4.1 Absolute maximum ratings
- 4.2 Thermal characteristics
- 4.3 ESD protection
- 4.4 Static latch-up (LU)
- 4.5 DC electrical specifications
- 4.6 Output pad loading and slew rate
- 4.7 DDR pad drive strengths
- 4.8 Oscillator and PLL electrical characteristics
- 4.9 Reset timing specifications
- 4.10 FlexBus timing specifications
- 4.11 NAND flash controller (NFC) timing specifications
- 4.12 DDR SDRAM controller timing specifications
- 4.13 USB transceiver timing specifications
- 4.14 ULPI timing specifications
- 4.15 eSDHC timing specifications
- 4.16 SIM timing specifications
- 4.17 SSI timing specifications
- 4.18 12-bit ADC specifications
- 4.19 12-bit DAC timing specifications
- 4.20 mcPWM timing specifications
- 4.21 I2C timing specifications
- 4.22 Ethernet assembly timing specifications
- 4.23 32-bit timer module timing specifications
- 4.24 DSPI timing specifications
- 4.25 SBF timing specifications
- 4.26 1-Wire timing specifications
- 4.27 General purpose I/O timing specifications
- 4.28 Rapid general purpose I/O timing specifications
- 4.29 JTAG and boundary scan timing specifications
- 4.30 Debug AC timing specifications
- 5 Package information
- 6 Product documentation
- 7 Revision history
Electrical characteristics
MCF5441x ColdFire Microprocessor Data Sheet, Rev. 8
Freescale Semiconductor 21
4 Electrical characteristics
This document contains electrical specification tables and reference timing diagrams for the MCF5441x microprocessor. This
section contains detailed information on AC/DC electrical characteristics and AC timing specifications.
NOTE
The specifications for this device in any other document are superseded by the
specifications in this document.
4.1 Absolute maximum ratings
Table 6. Absolute maximum ratings
1,
2
1
Functional operating conditions are given in Ta bl e 1 1 . Absolute maximum ratings are stress ratings only, and
functional operation at the maximum is not guaranteed. Continued operation at these levels may affect device
reliability or cause permanent damage to the device.
2
This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, it
is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated
voltages to this high-impedance circuit. Immunity to static and electrical fields is enhanced if unused inputs are tied
to an appropriate logic voltage level (e.g., V
SS
or EV
DD
).
Rating Symbol Pin name Value Units
External I/O pad supply voltage EV
DD
EVDD
–0.3 to +4.0 V
Internal logic supply voltage IV
DD
IVDD
–0.5 to +2.0 V
FlexBus I/O pad supply voltage FBV
DD
FB_VDD
–0.3 to +4.0 V
SDRAM I/O pad supply voltage SDV
DD
SD_VDD
–0.3 to +4.0 V
PLL supply voltage PV
DD
VDD_OSC_A_PLL
–0.3 to +4.0 V
USB OTG supply voltage USBV
DD
VDD_USBO
–0.3 to +4.0 V
USB host supply voltage USBV
DD
VDD_USBH
–0.3 to +4.0 V
ADC supply voltage AV
DD
VDDA_ADC
–0.3 to +4.0 V
DAC and ADC supply voltage —
VDDA_DAC_ADC
–0.3 to +4.0 V
RTC standby supply voltage RTCV
STBY
VSTBY_RTC
–0.3 to +4.0 V
Digital input voltage
3
3
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, and then use the larger of the two values.
V
IN
— –0.3 to +3.6 V
Instantaneous maximum current
Single pin limit (applies to all pins)
3, 4, 5
4
All functional non-supply pins are internally clamped to V
SS
and EV
DD
.
5
Power supply must maintain regulation within operating EV
DD
, FBV
DD
, and SDV
DD
range during instantaneous and
operating maximum current conditions. If positive injection current (V
in
> EV
DD
, FBV
DD
, or SDV
DD
) is greater than
I
DD
, the injection current may flow out of EV
DD
, FBV
DD
, or SDV
DD
and could result in external power supply going
out of regulation. Ensure the external EV
DD
, FBV
DD
, or SDV
DD
load shunts current greater than maximum injection
current. This is the greatest risk when the MPU is not consuming power (for example, no clock).
I
DD
—25mA
Operating temperature range (packaged) T
A
(T
L
– T
H
)
— –40 to +85 C
Storage temperature range T
stg
— –55 to +150 C