Datasheet

MC68HC908JL3E Family Data Sheet, Rev. 4
Freescale Semiconductor 147
Chapter 17
Mechanical Specifications
17.1 Introduction
This section gives the dimensions for:
• 20-pin plastic dual in-line package (case #738)
• 20-pin small outline integrated circuit package (case #751D)
• 28-pin plastic dual in-line package (case #710)
• 28-pin small outline integrated circuit package (case #751F)
• 48-pin low-profile quad flat pack (case #932)
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
17.2 Package Dimensions
Refer to the following pages for detailed package dimensions.
20-Pin PDIP (Case #738)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J
20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M 0 15 0 15
N 0.51 1.010.020 0.040
E
1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D
20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC