Freescale Semiconductor Technical Data Document Number: MC33810 Rev. 10.0, 4/2011 Automotive Engine Control IC 33810 The 33810 is an eight channel output driver IC intended for automotive engine control applications. The IC consists of four integrated low side drivers and four low side gate pre-drivers. The low side drivers are suitable for driving fuel injectors, solenoids, lamps, and relays.
INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM VPWR VDD VDD VDD ~50 µA ~50 µA CS SI SCLK OUTEN VPWR, VDD V8.0 Analog V2.5 Logic POR, Over-voltage Under-voltage LOGIC CONTROL ~15 µA VDD ~15 µA SPI INTERFACE Oscillator Bandgap Bias V2.
PIN CONNECTIONS PIN CONNECTIONS OUT0 FB0 GD0 CS SCLK SI SO VDD OUTEN DIN0 DIN1 DIN2 DIN3 GD1 FB1 OUT1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 GND 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OUT2 FB2 GD2 MAXI NOMI RSN RSP VPWR GIN0 GIN1 GIN2 GIN3 SPKDUR GD3 FB3 OUT3 Figure 3. 33810 Pin Connections Table 1. 33810 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.
PIN CONNECTIONS Table 1. 33810 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 15. Pin Number Pin Name Pin Function Formal Name Definition 9 OUTEN Input Output Enable The Output Enable pin (OUTEN) is an active low input. When the OUTEN pin is low, the device outputs are active. The outputs are disabled when OUTEN is high.
ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Ratings Symbol Value Unit VPWR -1.5 to 45 VDC VDD -0.3 to 7.0 VDC VIL -0.3 to VDD VDC VFB -1.5 to 60 VDC VOUTX -1.5 to 60 VDC VGDx -0.3 to 10 VDC ECLAMP 100 mJ ECLAMP 100 mJ IOSSSS 2.0 A Maximum Voltage for RSN and RSP inputs VRSX -0.3 - VDD VDC Frequency of SPI Operation (VDD = 5.0 V) – 6.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Ratings Symbol Value Unit Notes 1. Exceeding these limits may cause malfunction or permanent damage to the device. 2. ESD data available upon request. 3. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-002), the Machine Model (MM) (AEC-Q100003), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max Unit Notes 4. These parameters are guaranteed by design, but not production tested.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25°C.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max Unit Notes 10. This parameter is guaranteed by design, however is not production tested. 11.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max ILOGIC_PD 30 50 100 Input Logic Pull-down Current 0.8 to 5.0 V (DINX and GINX) Unit μA Notes 12.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max 5.
ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max Unit 1.0 – – 1.0 – – tSC 30 60 90 µs t(ON)OC 3.0 7.
ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions of 3.0 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 32 V, -40°C ≤ TC ≤ 125°C, and calibrated timers, unless otherwise noted. Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS CS 0.2 VDD tLAG tLEAD 0.7 VDD 0.2 VDD SCLK tSI(SU) SI 0.7 VDD 0.2 VDD tSI(HOLD) MSB IN tSO(EN) SO 0.7 VDD 0.
FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION ANALOG SUPPLY VOLTAGE (VPWR) SERIAL INPUT DATA (SI) The VPWR pin is the battery input to the 33810 IC. The VPWR pin requires external reverse battery and transient protection. All IC analog current and internal logic current is provided from the VPWR pin. With VDD applied to the IC, the application of VPWR will perform a POR. The SI pin is used for serial instruction data input.
FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION LOW SIDE INJECTOR DRIVER OUTPUT (OUT0 OUT3) OUT0 - OUT3 are the Open drain low side (Injector) driver outputs. The drain voltage is actively clamped during turn off of inductive loads. These outputs can be connected in parallel for higher current loads provided the turn off energy rating is not exceeded. RESISTOR SENSE POSITIVE (RSP) Resistor Sense Positive - Positive input of a current sense amplifier.
FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION Figure 4. Functional Internal Block Diagram POWER SUPPLY/POR The 33810 is designed to operate from 4.5 to 36 V on the VPWR pin. The VPWR pin supplies power to all internal regulators, analog, and logic circuit blocks. The VDD supply is used for setting communication threshold levels and supplying power to the SO driver. This IC architecture provides a low quiescent current sleep mode.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES POWER SUPPLY The 33810 is designed to operate from 4.5 to 36 V on the VPWR pin. The VPWR pin supplies power to all internal regulators, analog and logic circuit blocks. The VDD supply is used for setting communication threshold levels and supplying power to the SO driver. This IC architecture provides flexible microprocessor interfacing and low quiescent current sleep mode.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES the MAXI shutdown signal for GD0 and GD2 and the new NOMI input pin receives the MAXI shutdown signal for GD1 and GD3. Further information on V10 Mode is provided in the V10 Application section. Note: RSN and RSP must be grounded in V10 Mode. OVER/UNDER-VOLTAGE SHUTDOWN/RETRY BIT The Over/Under-voltage Shutdown/Retry bit allows the user to select the global over and under-voltage fault strategy for all the outputs.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES • • • • • • • Secondary clamp (secondary clamp bit) Soft shutdown enable (SoftShutDn bit) Ignition ignition coil current amplifier gain (Gain Sel bit) Overlapping dwell disable (Overlap Dwell Disable bit) Maximum dwell enable (MaxDwellEn bit) Maximum dwell timer (MaxDwellTimer bits) End of spark filter timer value Spark Command address and data bits are listed in Table 20 NOTE: Gate driver outputs programmed to be General Purpose Gate Drivers are not affected
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Figure 7. Open Secondary Spark Event The Low-voltage Clamp spreads out the energy dissipation over a longer period of time, thus allowing the use of a lower energy rated IGBTs. The internal low-voltage clamp is connected between the IGBT's collector (through an external resistor) and the IGBT's gate. The energy stored in the ignition coil is dissipated by the IGBT, not the internal clamp. The internal clamp only provides the bias to the IGBT.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES • Max dwell time Soft Shutdown is designed to prevent an ignition spark while turning off the external IGBT. The Low-voltage Clamp is activated to provide the mechanism for a soft shutdown. The Max Dwell gate turn off signal is a logically ANDed with the Soft Shutdown bit to activate a Low-voltage Active Clamp (See Figure 9). Table 10.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Table 11. Nominal Current DAC Select Table 11. Nominal Current DAC Select DAC Command Bits<4,3,2,1,0> Differential Differential Voltage Voltage NOMI (mV (mV Current (A) Rs = 20 mΩ Rs = 40 mΩ (Gain = 2) (Gain = 1) 00000 3.00 60 120 00001 3.25 65 130 00010 3.50 70 140 00011 3.75 75 150 00100 4.00 80 160 00101 4.25 85 170 00110 4.50 90 180 00111 4.75 95 190 01000 5.00 100 200 01001 5.25 105 210 01010 5.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES GENERAL PURPOSE GATE DRIVER MODE Table 12. Maximum Current DAC Select DAC Command Bit Differential Differential MAXI Voltage (mV Voltage (mV Current (A) Rs = 20 mΩ Rs = 40 mΩ 0000 6.0 120 240 0001 7.0 140 280 0010 8.0 160 320 0011 9.0 180 360 0100 10.0 200 400 0101 11.0 220 440 0110 12.0 240 480 0111 13.0 260 520 1000 14.0 280 560 1001 15.0 300 600 1010 16.0 320 640 1011 17.0 340 680 1100 18.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES GPGD FLT Timer Bits Fault Timer Select 000 30µs Each gate driver is individually set to either, restore to the pre-fault state, or shutdown when a short fault is declared. By setting the Retry/Shutdown bit in the GPGD Fault Operation Command to logic 1 the specific output will try to go back to the pre-fault state when the fault is no longer declared, after a programmed “inhibit time”.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES V10 MODE . Table 16. Frequency Select PWM Freq&DC Command Bit Frequency Hz 000 10 Hz (default) 001 20 Hz 010 40 Hz 011 80 Hz 100 160 Hz 101 320 Hz 110 640 Hz 111 1.28 kHz Notes: Tolerance on selected frequency is ±10% after using the Calibration Command. Shorts to battery and open load faults will not be detected for frequency and duty cycle combinations inconsistent with fault timers. Table 17.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Bank 1 IC 1 “Parent” IGBT1 (0-3) Gate Drive 0 GO1 GIN1 IGBT14 IGBT15 Gate Drive 1 GIN2 GIN1 GO3 GIN3 LOGIC LOGIC RSP1 RS1 NOMI Comparator Ign 1 VtMI Child Comparator Inputs Tied to GND VtNI NOMI IGBT 2 (0-3) GIN0 GO1 GIN1 GO2 GIN2 GO3 GIN3 IGBT27 4 GIN (0-3) LOGIC NOMI RSP2 NOMI disabled Ign 2 VtMI MAXI disabled MAXI Comparator GO0 IGBT26 MAXI RSP VtNI Logic Buffer GO3 Gate Drive 3 4 GIN (0-3) GIN (0-3) MAXI GIN0 Gate
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES protection circuit uses the junction temperature of the output driver to determine the fault. Both methods may be used together or individually. TIMER PROTECTION The first protection scheme uses a low ON to OFF duty cycle to protect the output driver. The low duty cycle allows the device to cool so that the maximum junction temperatures are not exceeded. During a short condition, the device enters current limit.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Table 19. InjectorDriver Diagnostics Program State Fault temperature, calibration is required for an accurate time base. The calibration command should be used to update the device on a periodic basis.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Table 20.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES SPI RESPONSE REGISTERS faults. Timing between two write words must be greater than the fault timer to allow adequate time to sense and report the proper fault status. . Fault reporting is accomplished through the SPI interface. All logic [1]s received by the MCU via the SO pin indicate faults. All logic [0]s received by the MCU via Pin indicate no Table 21.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Table 21.
PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
PACKAGING PACKAGE DIMENSIONS .
PACKAGING PACKAGE DIMENSIONS EK (Pb-FREE) SUFFIX 32-PIN 98ASA10556D ISSUE D 33810 Analog Integrated Circuit Device Data Freescale Semiconductor 35
REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 3.0 10/2007 • Initial Release 4.0 2/2008 • Fixed several typos throughout document • Changed Static Electrical Characteristics, Table 3, Digital Interface, OUT_EN Leakage Current to VDD, maximum from 10 to 50μA. • Reworded Table 15. • Added Table 16 back (it was inadvertently deleted. • Added “Ignition &” to tile in Table 4. 5.0 8/2008 • Updated package drawing. 6.0 12/2008 7.
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