Datasheet

5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol Description Min. Max. Unit
T
J
Die junction temperature –40 125 °C
T
A
Ambient temperature –40 105 °C
5.4.2 Thermal attributes
Board type Symbol Description 144 LQFP 144
MAPBGA
Unit Notes
Single-layer
(1s)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
45 48 °C/W 1
Four-layer
(2s2p)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
36 29 °C/W 1
Single-layer
(1s)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
36 38 °C/W 1
Four-layer
(2s2p)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
30 25 °C/W 1
— R
θJB
Thermal
resistance,
junction to
board
24 16 °C/W 2
— R
θJC
Thermal
resistance,
junction to case
9 9 °C/W 3
— Ψ
JT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2 2 °C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
General
K10 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc. 21