Datasheet

6.3.3.2 32 kHz oscillator frequency specifications
Table 19. 32 kHz oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
f
osc_lo
Oscillator crystal — 32.768 — kHz
t
start
Crystal start-up time — 1000 — ms 1
f
ec_extal32
Externally provided input clock frequency — 32.768 — kHz 2
v
ec_extal32
Externally provided input clock amplitude 700 — V
BAT
mV 2, 3
1. Proper PC board layout procedures must be followed to achieve specifications.
2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The
oscillator remains enabled and XTAL32 must be left unconnected.
3. The parameter specified is a peak-to-peak value and V
IH
and V
IL
specifications do not apply. The voltage of the applied
clock must be within the range of V
SS
to V
BAT
.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 20. NVM program/erase timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
hvpgm4
Longword Program high-voltage time — 7.5 18 μs
t
hversscr
Sector Erase high-voltage time — 13 113 ms 1
t
hversblk256k
Erase Block high-voltage time for 256 KB — 416 3616 ms 1
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
rd1blk256k
Read 1s Block execution time
• 256 KB program/data flash — — 1.7 ms
t
rd1sec2k
Read 1s Section execution time (flash sector) — — 60 μs 1
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Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc. 31