Information

5.4.2 Thermal attributes
Board type Symbol Description 121
MAPBGA
100 LQFP Unit Notes
Single-layer
(1s)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
74 52 °C/W 1, 2
Four-layer
(2s2p)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
42 40 °C/W 1, 3
Single-layer
(1s)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
62 42 °C/W 1,3
Four-layer
(2s2p)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
38 34 °C/W 1,3
— R
θJB
Thermal
resistance,
junction to
board
23 25 °C/W 4
— R
θJC
Thermal
resistance,
junction to case
19 12 °C/W 5
— Ψ
JT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
4 2 °C/W 6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7
specification.
4. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
General
K10 Sub-Family Data Sheet, Rev. 3, 11/2012.
Freescale Semiconductor, Inc. 21