Datasheet

5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol Description Min. Max. Unit
T
J
Die junction temperature –40 125 °C
T
A
Ambient temperature –40 105 °C
5.4.2 Thermal attributes
Board type Symbol Description 100 LQFP Unit Notes
Single-layer (1s) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
47 °C/W 1
Four-layer (2s2p) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
35 °C/W 1
Single-layer (1s) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
37 °C/W 1
Four-layer (2s2p) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
29 °C/W 1
— R
θJB
Thermal
resistance, junction
to board
20 °C/W 2
— R
θJC
Thermal
resistance, junction
to case
9 °C/W 3
— Ψ
JT
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
2 °C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
General
K20 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc. 23