Datasheet

5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol Description Min. Max. Unit
T
J
Die junction temperature –40 125 °C
T
A
Ambient temperature –40 105 °C
5.4.2 Thermal attributes
Board type Symbol Description 81 MAPBGA 80 LQFP Unit Notes
Single-layer
(1s)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
65 50 °C/W 1
Four-layer
(2s2p)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
36 35 °C/W 1
Single-layer
(1s)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
52 39 °C/W 1
Four-layer
(2s2p)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
31 29 °C/W 1
— R
θJB
Thermal
resistance,
junction to
board
17 19 °C/W 2
— R
θJC
Thermal
resistance,
junction to case
13 8 °C/W 3
— Ψ
JT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
3 2 °C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
General
K20 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
22 Freescale Semiconductor, Inc.