Datasheet

2. V
DD
= 3.3 V, T
A
= 25 °C, f
OSC
= 12 MHz (crystal), f
SYS
= 96 MHz, f
BUS
= 48MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol Description Min. Max. Unit
C
IN_A
Input capacitance: analog pins — 7 pF
C
IN_D
Input capacitance: digital pins — 7 pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol Description Min. Max. Unit Notes
Normal run mode
f
SYS
System and core clock — 100 MHz
f
SYS_USB
System and core clock when Full Speed USB in
operation
20 — MHz
f
ENET
System and core clock when ethernet in operation
• 10 Mbps
• 100 Mbps
5
50
—
—
MHz
f
BUS
Bus clock — 50 MHz
FB_CLK FlexBus clock — 50 MHz
f
FLASH
Flash clock — 25 MHz
f
LPTMR
LPTMR clock — 25 MHz
General
K60 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc. 21