Datasheet

5.4.2 Thermal attributes
Board type Symbol Description 144 LQFP 144 MAPBGA Unit Notes
Single-layer
(1s)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
45 50 °C/W
Four-layer
(2s2p)
R
θJA
Thermal
resistance,
junction to
ambient (natural
convection)
36 30 °C/W
1
Single-layer
(1s)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
36 41 °C/W
1
Four-layer
(2s2p)
R
θJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
30 27 °C/W
1
— R
θJB
Thermal
resistance,
junction to
board
24 17 °C/W
— R
θJC
Thermal
resistance,
junction to case
9 10 °C/W
— Ψ
JT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2 2 °C/W
5.5 Power sequencing
Voltage supplies must be sequenced in the proper order to avoid damaging internal
diodes. There is no limit on how long after one supply powers up before the next supply
must power up. Note that V
DD
and V
DD_INT
can use the same power source.
The power-up sequence is:
1. V
DD
General
K60 Sub-Family, Rev5, 10/2013.
24 Freescale Semiconductor, Inc.