Datasheet

6.3.3.2 32 kHz oscillator frequency specifications
Table 19. 32 kHz oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
f
osc_lo
Oscillator crystal — 32.768 — kHz
t
start
Crystal start-up time — 1000 — ms
v
ec_extal32
Externally provided input clock amplitude 700 — V
BAT
mV 3
1. The parameter specified is a peak-to-peak value and V
IH
and V
IL
specifications do not apply. The voltage of the applied
clock must be within the range of V
SS
to V
BAT
.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFE) electrical specifications
This section describes the electrical characteristics of the FTFE module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 20. NVM program/erase timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
hvpgm8
Program Phrase high-voltage time — 7.5 18 μs
t
hversscr
Erase Flash Sector high-voltage time — 13 113 ms
t
hversblk128k
Erase Flash Block high-voltage time for 128 KB — 104 1808 ms 1
t
hversblk256k
Erase Flash Block high-voltage time for 256 KB — 208 3616 ms 1
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
rd1blk128k
t
rd1blk256k
Read 1s Block execution time
• 128 KB data flash
• 256 KB program flash
—
—
—
—
0.5
1.0
ms
ms
t
rd1sec4k
Read 1s Section execution time (4 KB flash) — — 100 μs 1
t
pgmchk
Program Check execution time — — 80 μs 1
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Peripheral operating requirements and behaviors
K60 Sub-Family, Rev5, 10/2013.
34 Freescale Semiconductor, Inc.