Datasheet

Board type Symbol Description 256 MAPBGA Unit Notes
— R
θJC
Thermal
resistance, junction
to case
8 °C/W 5
— Ψ
JT
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
2 °C/W 6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. Board meets JESD51-9 specification.
3. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
4. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
5. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
6. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
5.5 Power sequencing
Voltage supplies must be sequenced in the proper order to avoid damaging internal
diodes. There is no limit on how long after one supply powers up before the next supply
must power up. Note that V
DD
and V
DD_INT
can use the same power source.
The power-up sequence is:
1. V
DD
2. V
DD_INT
3. V
DDA
4. V
DD_DDR
The power-down sequence is the reverse:
1. V
DD_DDR
2. V
DDA
3. V
DD_INT
4. V
DD
6 Peripheral operating requirements and behaviors
Peripheral operating requirements and behaviors
K70 Sub-Family Data Sheet, Rev. 5, 10/2013.
Freescale Semiconductor, Inc. 27