Datasheet

Table 19. 32 kHz oscillator frequency specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
t
start
Crystal start-up time — 1000 — ms 1
v
ec_extal32
Externally provided input clock amplitude 700 — V
BAT
mV 2, 3
1. Proper PC board layout procedures must be followed to achieve specifications.
2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The
oscillator remains enabled and XTAL32 must be left unconnected.
3. The parameter specified is a peak-to-peak value and V
IH
and V
IL
specifications do not apply. The voltage of the applied
clock must be within the range of V
SS
to V
BAT
.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFE) electrical specifications
This section describes the electrical characteristics of the FTFE module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 20. NVM program/erase timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
hvpgm8
Program Phrase high-voltage time — 7.5 18 μs
t
hversscr
Erase Flash Sector high-voltage time — 13 113 ms 1
t
hversblk128k
Erase Flash Block high-voltage time for 128 KB — 104 1808 ms 1
t
hversblk256k
Erase Flash Block high-voltage time for 256 KB — 208 3616 ms 1
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol Description Min. Typ. Max. Unit Notes
t
rd1blk128k
t
rd1blk256k
Read 1s Block execution time
• 128 KB data flash
• 256 KB program flash
—
—
—
—
0.5
1.0
ms
ms
t
rd1sec4k
Read 1s Section execution time (4 KB flash) — — 100 μs 1
t
pgmchk
Program Check execution time — — 80 μs 1
Table continues on the next page...
Peripheral operating requirements and behaviors
K70 Sub-Family Data Sheet, Rev. 5, 10/2013.
Freescale Semiconductor, Inc. 37