Datasheet

Table 15. Thermal attributes (continued)
Board type Symbol Description 48
LQFP
32
LQFP
32 QFN 24 QFN Unit Notes
Single-layer (1S) R
θJMA
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
70 74 81 92 °C/W
Four-layer (2s2p) R
θJMA
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
52 52 28 36 °C/W
— R
θJB
Thermal resistance, junction
to board
36 35 13 18 °C/W 2
— R
θJC
Thermal resistance, junction
to case
27 26 2.3 3.7 °C/W 3
— Ψ
JT
Thermal characterization
parameter, junction to
package top outside center
(natural convection)
8 8 8 10 °C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
3 Peripheral operating requirements and behaviors
3.1 Core modules
3.1.1 SWD electricals
Table 16. SWD full voltage range electricals
Symbol Description Min. Max. Unit
Operating voltage 1.71 3.6 V
J1 SWD_CLK frequency of operation
• Serial wire debug 0 25 MHz
J2 SWD_CLK cycle period 1/J1 — ns
J3 SWD_CLK clock pulse width
Table continues on the next page...
Peripheral operating requirements and behaviors
18 Kinetis KL05 32 KB Flash, Rev4 03/2014.
Freescale Semiconductor, Inc.