Datasheet

3.3.2.2 Oscillator frequency specifications
Table 19. Oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
f
osc_lo
Oscillator crystal or resonator frequency — low-
frequency mode (MCG_C2[RANGE]=00)
32 — 40 kHz
f
osc_hi_1
Oscillator crystal or resonator frequency —
high-frequency mode (low range)
(MCG_C2[RANGE]=01)
3 — 8 MHz
f
osc_hi_2
Oscillator crystal or resonator frequency —
high frequency mode (high range)
(MCG_C2[RANGE]=1x)
8 — 32 MHz
f
ec_extal
Input clock frequency (external clock mode) — — 48 MHz 1, 2
t
dc_extal
Input clock duty cycle (external clock mode) 40 50 60 %
t
cst
Crystal startup time — 32 kHz low-frequency,
low-power mode (HGO=0)
— — ms 3, 4
Crystal startup time — 32 kHz low-frequency,
high-gain mode (HGO=1)
— — ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), low-power mode
(HGO=0)
— 0.6 — ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), high-gain mode
(HGO=1)
— 1 — ms
1. Other frequency limits may apply when external clock is being used as a reference for the FLL
2. When transitioning from FEI or FBI to FBE mode, restrict the frequency of the input clock so that, when it is divided by
FRDIV, it remains within the limits of the DCO input clock frequency.
3. Proper PC board layout procedures must be followed to achieve specifications.
4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S
register being set.
3.4 Memories and memory interfaces
3.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
3.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps
are active and do not include command overhead.
Peripheral operating requirements and behaviors
Kinetis KL05 32 KB Flash, Rev4 03/2014. 23
Freescale Semiconductor, Inc.