Datasheet

2.4.2 Thermal attributes
Table 16. Thermal attributes
Board type Symbol Description 80
LQFP
64
LQFP
48 QFN 32 QFN Unit Notes
Single-layer (1S) R
θJA
Thermal resistance, junction
to ambient (natural
convection)
70 71 84 92 °C/W 1
Four-layer (2s2p) R
θJA
Thermal resistance, junction
to ambient (natural
convection)
53 52 28 33 °C/W
Single-layer (1S) R
θJMA
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
— 59 69 75 °C/W
Four-layer (2s2p) R
θJMA
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
— 46 22 27 °C/W
— R
θJB
Thermal resistance, junction
to board
34 34 10 12 °C/W 2
— R
θJC
Thermal resistance, junction
to case
15 20 2.0 1.8 °C/W 3
— Ψ
JT
Thermal characterization
parameter, junction to
package top outside center
(natural convection)
0.6 5 5.0 8 °C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
3 Peripheral operating requirements and behaviors
3.1 Core modules
Peripheral operating requirements and behaviors
18 Kinetis KL24 Sub-Family, Rev4 03/2014.
Freescale Semiconductor, Inc.