Datasheet

MPC5121E/MPC5123 Data Sheet, Rev. 5
Electrical and Thermal Characteristics
Freescale Semiconductor24
3.1.6 Thermal Characteristics
Typical 300 mW D5.5
PHY Power Supplies (USB_VDDA, SATA_VDDA)
Typical 200 mW D5.6
1
Typical core power is measured at V
DD_CORE
= 1.4 V, T
j
= 25
o
C.
NOTE
The maximum power depends on the supply voltage, process corner,
junction temperature, and the concrete application and clock
configurations.
The worst case power consumption could reach a maximum of 2000 mW.
Table 10. Thermal Resistance Data
Rating Board Layers Symbol TEPBGA
TEPBGA
2
Value Unit SpecID
Junction to Ambient Natural
Convection
1,2
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Single layer board (1s) R
JA
31 24 30 °C/W D6.1
Junction to Ambient Natural
Convection
1,3
3
Per JEDEC JESD51-6 with the board horizontal.
Four layer board (2s2p) R
JMA
22 17 22 °C/W D6.2
Junction to Ambient (@200
ft/min)
1,3
Single layer board (1s) R
JMA
25 19 24 °C/W D6.3
Junction to Ambient (@200
ft/min)
1,3
Four layer board (2s2p) R
JMA
19 14 19 °C/W D6.4
Junction to Board
4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
— R
JB
14 9 14 °C/W D6.5
Junction to Case
5
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
— R
JC
9 7 8 °C/W D6.6
Junction to Package Top
6
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Natural Convection 
JT
2 7 2 °C/W D6.7
Table 9. Power Dissipation (continued)
Core Power Supply (V
DD_CORE
)
SpecID
Mode
High-Performance
Unit
e300 = 300 MHz, CSB = 200 MHz