Datasheet

Package Information
MPC5121E/MPC5123 Data Sheet, Rev. 5
Freescale Semiconductor 85
5 Package Information
This section details package parameters and dimensions. The MPC5121e/MPC5123 is available in a Thermally Enhanced
Plastic Ball Grid Array (TEPBGA), see
Section 5.1, “Package Parameters,” and Section 5.2, “Mechanical Dimensions,” for
information on the TEPBGA.
5.1 Package Parameters
5.2 Mechanical Dimensions
Figure 65 shows the mechanical dimensions and bottom surface nomenclature of the MPC5121e/MPC5123 516 PBGA
package.
Table 54. TEPBGA Parameters
Package outline 27 mm  27 mm
Interconnects 516
Pitch 1.00 mm
Module height (typical) 2.25 mm
Solder Balls 96.5 Sn/3.5Ag (VY package)
Ball diameter (typical) 0.6 mm