Datasheet

MPC5200 Data Sheet, Rev. 4
Package Description
Freescale Semiconductor64
4 Package Description
4.1 Package Parameters
The MPC5200 uses a 27 mm x 27 mm TE-PBGA package. The package parameters are as provided in the
following list:
• Package outline 27 mm x 27 mm
• Interconnects 272
• Pitch 1.27 mm
4.2 Mechanical Dimensions
Figure 51 provides the mechanical dimensions, top surface, side profile, and pinout for the MPC5200, 272
TE-PBGA package.