Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
12 Freescale Semiconductor
Electrical and Thermal Characteristics
4.3 Power Characteristics
Table 5 provides preliminary estimated power consumption data for the MPC8241.
Table 5. Preliminary Power Consumption
Mode
PCI Bus Clock/Memory Bus Clock
CPU Clock Frequency (MHz)
Unit Notes
33/66/133 33/66/166 33/66/200 33/100/200 66/100/200 66/66/ 266 66/133/ 266
Typical 0.7 0.8 1.0 1.0 1.0 1.5 1.8 W 1, 5
MaxCFP0.81.01.21.31.31.92.1W1, 2
Max—INT 0.8 0.9 1.0 1.2 1.2 1.6 1.8 W 1, 3
Doze 0.5 0.6 0.7 0.8 0.8 1.0 1.3 W 1, 4, 6
Nap 0.2 0.2 0.3 0.4 0.4 0.4 0.7 W 1, 4, 6
Sleep 0.2 0.2 0.2 0.2 0.3 0.2 0.4 W 1, 4, 6
I/O Power Supplies
7
Mode Minimum Maximum Unit Notes
GV
DD
_OV
DD
500 1130 mW 8
Notes:
1. The values include V
DD
, AV
DD
, and AV
DD
2 but do not include I/O supply power.
2. Maximum—FP power is measured at V
DD
= 1.9 V with dynamic power management enabled while running an entirely
cache-resident, looping, floating-point multiplication instruction.
3. Maximum—INT power is measured at V
DD
= 1.9 V with dynamic power management enabled while running entirely
cache-resident, looping, integer instructions.
4. Power saving mode maximums are measured at V
DD
= 1.9 V while the device is in doze, nap, or sleep mode.
5. Typical power is measured at V
DD
= AV
DD
= 1.8 V, GV
DD
_OV
DD
= 3.3 V where a nominal FP value, a nominal INT value, and
a value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries to local memory
are averaged.
6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled.
7. Power consumption of PLL supply pins (AV
DD
and AV
DD
2) < 15 mW, guaranteed by design, but not tested.
8. The typical maximum GV
DD
_OV
DD
value resulted from the MPC8241 operating at the fastest frequency combination of
66:133:266 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros to PCI
memory and on 64-bit boundaries to local memory.