Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor 31
Package Description
Figure 23. Test Access Port Timing Diagram
5 Package Description
This section details package parameters, pin assignments, and dimensions.
5.1 Package Parameters for the MPC8241
The MPC8241 uses a 25 mm × 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The
package parameters are as follows.
Package outline 25 mm × 25 mm
Interconnects 357
Pitch 1.27 mm
Solder balls ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts
ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag
VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
Solder ball diameter 0.75 mm
Maximum module height 2.52 mm
Co-planarity specification 0.15 mm
Maximum force 6.0 lbs. total, uniformly distributed over package (8 grams/ball)
10
11
Input Data Valid
12
13
Output Data Valid
TCK
TDI, TMS
TDO
TDO