Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
32 Freescale Semiconductor
Package Description
5.2 Pin Assignments and Package Dimensions
Figure 24 shows the top surface, side profile, and pinout of the MPC8241, 357 PBGA ZP package. Note
that this is available for Rev. B parts only.
Figure 24. MPC8241 Package Dimensions and Pinout Assignments (ZP Package)
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
SIDE VIEW
BOTTOM VIEW
18X
4X
357X b
TOP VIEW
A2
A3
e
0.30
M
C
D
A
A1
D2
0.15
M
C
EE2
0.20 C
A
B
0.2
D1
E1
AB
0.25 C
0.35 C
C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUM SOLDER
BALL DIAMETER MEASURED PARALLEL TO
DATUM C.
DIM MIN MAX
MILLIMETERS
A --- 2.05
A1 0.50 0.70
A2 0.95 1.35
A3 0.70 0.90
b 0.60 0.90
D 25.00 BSC
D1 22.86 BSC
D2 22.40 22.60
e 1.27 BSC
E 25.00 BSC
E1 22.86 BSC
E2 22.40 22.60