Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
48 Freescale Semiconductor
System Design Information
Figure 29. Die Junction-to-Ambient Resistance
The board designer can choose among several types of heat sinks to place on the MPC8241. Several
commercially available heat sinks for the MPC8241 are provided by the following vendors:
Aavid Thermalloy 603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech 408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics 800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering 603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,
Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, and may or may not need airflow.
0.0
10.0
20.0
30.0
40.0
50.0
00.511.522.5
Airflow Velocity (m/s)
Die Junction-to-Ambient
Thermal Resistance (C/W)
1s
2s2p
1s/sink
2s2p/sink
Die Junction-to-Ambient
Thermal Resistance (°C/W)
Airflow Velocity (m/s)