Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
50 Freescale Semiconductor
System Design Information
Figure 31. Thermal Performance of Select Thermal Interface Material
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
The Bergquist Company 800-347-4572
18930 West 78
th
St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation 800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0 1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific Thermal Resistance (K-in.
2
/W)