Datasheet

MPC8241 Integrated Processor Hardware Specifications, Rev. 10
54 Freescale Semiconductor
Document Revision History
8.3 Part Marking
Parts are marked as the example shown in Figure 32.
Figure 32. Part Marking for MPC8241 Device
9 Document Revision History
Table 21 provides a revision history for this hardware specification.
MPC 8241 T = Extended
temperature spec.
–40° to 105°C
ZQ = thick substrate and
thick mold cap PBGA (two
layers)
166, 200
@ 1.8 V
±100mV
D:1.4 =
Rev. ID:0x14
0x80811014
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by hardware specifications addendums may support
other maximum core frequencies.
Table 21. Revision History Table
Revision Date Substantive Change(s)
10 02/2009 In Ta b l e 1 6 , “MPC8241 Pinout Listing,” added footnote 10 to PMAA[2].
In Ta b le 1 6 , “MPC8241 Pinout Listing,” removed footnote 12 for second listing of RCS3
/TRIG_OUT .
9 09/2007 Completely replaced Section 4.6 with compliant I
2
C specifications as with other related integrated
processor devices.
Section 7.6, “JTAG Configuration Signals” Reworded paragraph beginning “The arrangement
shown in Figure 27 .. .”
Table 20. Part Numbers Addressed by MPC8241TXXPNS Series
(Document No. MPC8241ECSO1AD))
MPC nnnn
T
xx nnn x
Notes:
ATWLYYWW is traceability code.
MPC8241LXXnnnx
MMMMM
ATWLYYWW
CCCCC
MMMMM is the 5-digit mask number.
CCCCC is the country code.