Datasheet

MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor 31
Package Description
Figure 23. Test Access Port Timing Diagram
5 Package Description
This section details package parameters, pin assignments, and dimensions.
5.1 Package Parameters
The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Package Outline 35 mm × 35 mm
Interconnects 352
Pitch 1.27 mm
Solder Balls ZU (TBGA package)—62 Sn/36 Pb/2 Ag
VV (Lead-free version of package)
—95.5 Sn/4.0 Ag/0.5 Cu
Solder Ball Diameter 0.75 mm
Maximum Module Height 1.65 mm
Co-Planarity Specification 0.15 mm
Maximum Force 6.0 lbs. total, uniformly distributed over package (8 grams/ball)
10 11
Input Data Valid
12
13
Output Data Valid
TCK
TDI, TMS
TDO
TDO