Datasheet

MPC8245 Integrated Processor Hardware Specifications, Rev. 10
50 Freescale Semiconductor
System Design
7.8 Thermal Management
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks can be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.
Figure 27 displays a package-exploded cross-sectional view of a TBGA package with several heat sink
options.
Figure 27. Package-Exploded Cross-Sectional View with Several Heat Sink Options
Figure 28 depicts the die junction-to-ambient thermal resistance for four typical cases:
• A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
from adjacent components.
• A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from
adjacent components.
• A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high
board-level thermal loading from adjacent components.
• A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low
board-level thermal loading from adjacent components.
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Adhesive or