Datasheet

MPC8245 Integrated Processor Hardware Specifications, Rev. 10
32 Freescale Semiconductor
Package Description
5.2 Pin Assignments and Package Dimensions
Figure 24 shows the top surface, side profile, and pinout of the MPC8245, 352 TBGA package.
Figure 24. MPC8245 Package Dimensions and Pinout Assignments
B
A
C
– E –
– F –
0.150
– T –
T
H
G
25 23 21 19 17 15 13 11 9 7 5 3 1
A
C
E
G
J
L
N
R
U
W
AA
AC
AE
352X ∅ D
MIN MAX
A 34.8 35.2
B 34.8 35.2
C 1.45 1.65
D.60 .90
G 1.27 BASIC
H.85 .95
K 31.75 BASIC
L.50 .70
Top View
Notes:
26 24 22 20 18 16 14 12 10 8 6 4 2
B
D
F
H
K
M
P
T
V
Y
AB
AD
AF
CORNER
K
L
Bottom View
1. Drawing not to scale.
2. All measurements are in millimeters (mm).
K
Dot on top indicates
corner of A1 pin on
bottom