Datasheet

MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor 51
System Design
Figure 28. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Aavid Thermalloy 603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech 408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics 800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
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00.511.522.5
Die Junction-to-Ambient Thermal Resistance (°C/W)
Airflow Velocity (m/s)
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components