Datasheet

MPC8250 Hardware Specifications, Rev. 2
44 Freescale Semiconductor
Pinout
Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 16. Side View of the PBGA Package
Table 22 shows the pinout list of the PBGA package of the MPC8250. Table 21 defines conventions and
acronyms used in Table 22.
Table 21. Symbol Legend
Symbol Meaning
OVERBAR Signals with overbars, such as TA
, are active low.
MII Indicates that a signal is part of the media independent interface.
Table 22. MPC8250 PBGA Package Pinout List
Pin Name Ball
BR C16
BG D2
ABB/IRQ2 C1
TS D1
A0 D5
A1 E8
A2 C4
A3 B4
A4 A4
A5 D7
A6 D8
A7 C6
A8 B5
A9 B6
A10 C7
A11 C8
A12 A6
A13 D9
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Plated substrate via