Datasheet

MPC8250 Hardware Specifications, Rev. 2
56 Freescale Semiconductor
Package Description
5.1 Package Parameters
Package parameters are provided in Table 23.
5.2 Mechanical Dimensions
This section discusses the TBGA and PBGA package dimensions.
Table 23. Package Parameters
Package Devices
Outline
(mm)
Type Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU MPC8250 37.5 × 37.5 TBGA 480 1.27 1.55
VV TBGA (Pb free)
ZO 27 × 27 PBGA 516 1 2.25
VR PBGA (Pb free)