Datasheet

MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
46 Freescale Semiconductor
Package Description
5 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1 Package Parameters
Package parameters are provided in Table 22. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
3
On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and
MPC8264) this is a spare pin that must be pulled down or left floating.
4
Must be pulled down or left floating.
5
On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or
left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled
up or left floating.
6
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at
www.freescale.com.
Table 22. Package Parameters
Parameter Value
Package Outline 37.5 × 37.5 mm
Interconnects 480 (29 × 29 ball array)
Pitch 1.27 mm
Nominal unmounted package height 1.55 mm