Datasheet

MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
8 Freescale Semiconductor
Electrical and Thermal Characteristics
Table 2 lists recommended operational voltage conditions.
NOTE: Core, PLL, and I/O Supply Voltages
VDDH, VCCSYN, and VDD must track each other and both must vary in
the same direction—in the positive direction (+5% and +0.1 Vdc) or in the
negative direction (–5% and –0.1 Vdc).
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or V
CC
).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the
MPC8280. Note that in PCI mode the I/O interface is different.
Figure 2. Overshoot/Undershoot Voltage
Table 2. Recommended Operating Conditions
1
1
Caution: These are the recommended and tested operating conditions. Proper device operating outside of these
conditions is not guaranteed.
Rating Symbol Value Unit
Core supply voltage VDD 1.7 – 1.9
2
2
CPU frequency less than or equal to 200 MHz.
1.7–2.1
3
3
CPU frequency greater than 200 MHz but less than 233 MHz.
1.9 –2.2
4
4
CPU frequency greater than or equal to 233 MHz.
V
PLL supply voltage VCCSYN 1.7 – 1.9
2
1.7–2.1
3
1.9–2.2
4
V
I/O supply voltage VDDH 3.135 – 3.465 V
Input voltage VIN GND (–0.3) – 3.465 V
Junction temperature (maximum) T
j
105
5
5
Note that for extended temperature parts the range is (-40)
T
A
– 105
T
j
.
°C
Ambient temperature T
A
0–70
5
°C
GND
GND – 0.3 V
GND – 1.0 V
Not to exceed 10%
GV
DD
of t
SDRAM_CLK
GV
DD
+ 5%
4 V
V
IH
V
IL