Datasheet
MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
10 Freescale Semiconductor
Power Characteristics
Figure 3. MPC8306 Power-Up Sequencing Example
3 Power Characteristics
The typical power dissipation for this family of MPC8306 devices is shown in the following table.
Table 5. MPC8306 Power Dissipation
Core
Frequency (MHz)
QUICC Engine
Frequency (MHz)
CSB
Frequency (MHz)
Typical Maximum Unit Note
133 133 133 0.272 0.618 W 1, 2, 3
200 233 133 0.291 0.631 W 1, 2, 3
266 233 133 0.451 0.925 W 1, 2, 3
333 233 133 0.471 0.950 W 1, 2, 3
Notes:
1. The values do not include I/O supply power (OV
DD
and GV
DD
), but it does include V
DD
and AV
DD
power. For I/O power
values, see Table 6.
2. Typical power is based on a nominal voltage of V
DD
= 1.0 V, ambient temperature, and the core running a Dhrystone
benchmark application. The measurements were taken on the evaluation board using WC process silicon.
3. Maximum power is based on a voltage of V
DD
= 1.05 V, WC process, a junction T
J
= 105C, and a smoke test code.
t
90%
V
Core Voltage (V
DD
)
I/O Voltage (GV
DD
and OV
DD
)
0
0.7 V
PORESET
>= 32 t
SYS_CLK_IN