Datasheet

MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
48 Freescale Semiconductor
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8306 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 21.1, “Package
Parameters for the MPC8306,” and Section 21.2, “Mechanical Dimensions of the MPC8306 MAPBGA,”
for information on the MAPBGA.
21.1 Package Parameters for the MPC8306
The package parameters are as provided in the following list.
Package outline 19 mm 19 mm
Package Type MAPBGA
Interconnects 369
Pitch 0.80 mm
Module height (typical) 1.48 mm; Min = 1.31mm and Max 1.61mm
Solder Balls 96 Sn / 3.5 Ag / 0.5 Cu (VM package)
Ball diameter (typical) 0.40 mm
21.2 Mechanical Dimensions of the MPC8306 MAPBGA
The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8306, 369-MAPBGA package.