Datasheet

MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
Freescale Semiconductor 49
Package and Pin Listings
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8306 MAPBGA
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.