Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 10 kPa Print

MPX10

Rev 14, 10/2008

Freescale Semiconductor

Pressure

10 kPa Uncompensated

Silicon Pressure Sensors

The MPX10 series silicon piezoresistive pressure sensors provide a very

accurate and linear voltage output, directly proportional to the applied

pressure. These standard, low cost, uncompensated sensors permit

manufacturers to design and add their own external temperature

compensation and signal conditioning networks. Compensation techniques

are simplified because of the predictability of Freescale's single element

strain gauge design.

Features

• Low Cost

• Patented Silicon Shear Stress Strain Gauge Design

• Ratiometric to Supply Voltage

• Differential and Gauge Options

• Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount

Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX10 Series)

MPX10D

Tray 344 • •

MPX10D

MPX10DP

Tray 344C • •

MPX10DP

MPX10GP

Tray 344B • •

MPX10GP

Small Outline Package (MPXV10G Series)

MPXV10GC6U

Rail 482A • •

MPXV10G

MPXV10GC7U

Rail 482C • •

MPXV10G

MPX10

Series

0 to 10 kPa (0 to 1.45 psi)

35 mV Full Scale Span

(Typical)

SMALL OUTLINE PACKAGE

MPXV10GC6U

CASE 482A-01

MPXV10GC7U

CASE 482C-03

UNIBODY PACKAGE

MPX10D

CASE 344-15

MPX10GP

CASE 344B-01

MPX10DP

CASE 344C-01

Application Examples

• Air Movement Control

• Environmental Control Systems

• Level Indicators

• Leak Detection

• Medical Instrumentation

• Industrial Controls

• Pneumatic Control Systems

• Robotics

Summary of content (9 pages)

PAGE 1
Pressure Freescale Semiconductor MPX10 Rev 14, 10/2008 + 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 10 kPa VS — 3.0 6.0 VDC IO — 6.0 — mAdc Full Scale Span(3) VFSS 20 35 50 mV Offset(4) VOFF 0 20 35 mV Sensitivity ΔV/ΔΡ — 3.5 — mV/kPa Linearity — –1.0 — 1.0 %VFSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis — — ±0.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG –40 to +125 °C TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. 3 +VS 2 Sensing Element 4 +VOUT –VOUT 1 GND Figure 1.
PAGE 4
Pressure Temperature Compensation Figure 2 shows the typical output characteristics of the MPX10 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
PAGE 6
Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3.
PAGE 7
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.
PAGE 8
Pressure PACKAGE DIMENSIONS CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX10 8 Sensors Freescale Semiconductor
PAGE 9
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.