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MPX12

Rev 11, 07/2009

Freescale Semiconductor

Pressure

10 kPa Uncompensated

Silicon Pressure Sensors

The MPX12 series silicon piezoresistive pressure sensors provide a very

accurate and linear voltage output, directly proportional to the applied

pressure. This standard, low cost, uncompensated sensor permits

manufacturers to design and add their own external temperature

compensating and signal conditioning networks. Compensation techniques

are simplified because of the predictability of Freescale's single element

strain gauge design.

Features

• Low Cost

• Patented Silicon Shear Stress Strain Gauge Design

• Ratiometric to Supply Voltage

• Easy to Use Chip Carrier Package Options

• Gauge Options

• Durable Epoxy Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX12 Series)

MPX12D

Tray 344 • •

MPX12D

MPX12DP

Tray 344C • •

MPX12DP

MPX12GP

Tray 344B • •

MPX12GP

Small Outline Package (MPXV12 Series)

MPXV12DP

Tray 1351 • •

MPXV12DP

MPXV12GP

Tray 1369 • •

MPXV12GP

MPXV12GW6U

Rail 1735 • •

MPXV12GW

MPXV12GW7U

Rail 1560 • •

MPXV12GW

MPAK Package (MPXM12 Series)

MPXM12GS

Rail 1320A • •

MPXM12GS

MPXM12GST1

Tape & Reel 1320A • •

MPXM12GS

MPX12

0 to 10 kPa (0 to 1.45 psi)

55 mV Full Scale Span

(Typical)

Series

Application Examples

• Air Movement Control

• Environmental Control Systems

• Level Indicators

• Leak Detection

• Medical Instrumentation

• Industrial Controls

• Pneumatic Control Systems

• Robotics

Summary of content (20 pages)

PAGE 1
Pressure Freescale Semiconductor MPX12 Rev 11, 07/2009 10 kPa Uncompensated Silicon Pressure Sensors MPX12 Series The MPX12 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks.
PAGE 2
Pressure UNIBODY PACKAGES MPX12D CASE 344-15 MPX12GP CASE 344B-01 MPX12DP CASE 344C-01 SMALL OUTLINE PACKAGES MPXV12DP CASE 1351-01 MPXV12GP CASE 1369-01 MPXV12GW6U CASE 1735-02 MPXV12GW7U CASE 1560-02 MPAK PACKAGE MPXM12GS/GST1 CASE 1320A-02 MPX12 2 Sensors Freescale Semiconductor
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP 0 — 10 kPa Supply Voltage VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc VFSS 45 55 70 mV Voff 0 20 35 mV ΔV/ΔP — 5.5 — mV/kPa — –0.5 — 5.0 %VFSS — — ±0.1 — %VFSS Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCVFSS –0.22 — –0.
PAGE 4
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG –40 to +125 °C TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. 3 +VS 2 Sensing Element 4 +VOUT –VOUT 1 GND Figure 1.
PAGE 5
Pressure Temperature Compensation Figure 2 shows the typical output characteristics of the MPX12 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors.
PAGE 6
Pressure Stainless Steel Cap Die Gel Die Coat P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential/gauge die. A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
PAGE 7
Pressure PACKAGE DIMENSIONS C R M 1 B 2 –A– Z 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J F G F D Y 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL M STYLE 2: PIN 1. 2. 3. 4.
PAGE 8
Pressure PACKAGE DIMENSIONS PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– –T– 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.
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Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 9
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Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 10 Sensors Freescale Semiconductor
PAGE 11
Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
PAGE 12
Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 12 Sensors Freescale Semiconductor
PAGE 13
Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 13
PAGE 14
Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 14 Sensors Freescale Semiconductor
PAGE 15
Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 15
PAGE 16
Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 16 Sensors Freescale Semiconductor
PAGE 17
Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 17
PAGE 18
Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 18 Sensors Freescale Semiconductor
PAGE 19
Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 Sensors Freescale Semiconductor 19
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How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.