Datasheet

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MPX2050

Rev 9, 10/2008

Freescale Semiconductor

Pressure

50 kPa On-Chip Temperature

Compensated and Calibrated

Silicon Pressure Sensors

The MPX2050 series devices are silicon piezoresistive pressure sensors

providing a highly accurate and linear voltage output, directly proportional to the

applied pressure. The sensor is a single, monolithic silicon diaphragm with the

strain gauge and a thin-film resistor network integrated on-chip. The chip is laser

trimmed for precise span and offset calibration and temperature compensation.

Features

• Temperature Compensated Over 0°C to +85°C

• Unique Silicon Shear Stress Strain Gauge

• Easy to Use Chip Carrier Package Options

• Ratiometric to Supply Voltage

• Differential and Gauge Options

• ±0.25% Linearity

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX2050 Series)

MPX2050D

Tray 344

• •

MPX2050D

MPX2050GP

Tray 344B

• •

MPX2050GP

MPX2050DP

Tray 344C

• •

MPX2050DP

MPX2050GSX

Tray 344F

• •

MPX2050D

MPX2050

Series

0 to 50 kPa (0 to 7.25 psi)

40 mV Full Scale Span

(Typical)

PACKAGES

MPX2050D

CASE 344-15

MPX2050GP

CASE 344B-01

MPX2050DP

CASE 344C-01

MPX2050GSX

CASE 344F-01

Application Examples

• Pump/Motor Controllers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Non-Invasive Blood Pressure

Summary of content (9 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX2050 Rev 9, 10/2008 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2050 Series 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale Span (Typical) The MPX2050 series devices are silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output, directly proportional to the applied pressure.
PAGE 2
Pressure Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 +VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied.
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Voff -1.0 — 1.0 mV ΔV/ΔP — 0.8 — mV/kPa Linearity — -0.25 — 0.25 %VFSS Pressure Hysteresis(5) (0 to 50 kPa) — — ±0.
PAGE 4
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Least Squares Fit Relative Voltage Output LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range.
PAGE 5
Pressure On-Chip Temperature Compensation and Calibration Figure 3 shows the minimum, maximum and typical output characteristics of the MPX2050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. VS = 10 Vdc TA = 25°C MPX2050 P1 > P2 40 Output (mVdc) 35 30 25 20 The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (Typ) MAX 15 10 MIN 5 0 -5 kPa 0 PSI 12.
PAGE 6
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3.
PAGE 7
Pressure PACKAGE DIMENSIONS C R M 1 B -A- 2 Z 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4.
PAGE 8
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- 0.25 (0.010) -T- M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.
PAGE 9
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.