Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 200 kPa Print

MPX2200

Rev 13, 10/2008

Freescale Semiconductor

Pressure

200 kPa On-Chip Temperature

Compensated Silicon

Pressure Sensors

The MPX2200 series devices are silicon piezoresistive pressure sensor

providing a highly accurate and linear voltage output directly proportional to

the applied pressure. The sensor is a single monolithic silicon diaphragm with

the strain gauge and a thin-film resistor network integrated on-chip. The chip

is laser trimmed for precise span and offset calibration and temperature

compensation. They are designed for use in applications such as pump/

motor controllers, robotics, level indicators, medical diagnostics, pressure

switching, barometers, altimeters, etc.

Features

• Temperature Compensated Over 0°C to +85°C

• ±0.25% Linearity (MPX2200D)

• Easy-to-Use Chip Carrier Package Options

• Absolute, Differential and Gauge Options

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX2200 Series)

MPX2200A

Tray 344

• •

MPX2200A

MPX2200D

Tray 344

• •

MPX2200D

MPX2200DP

Tray 344C

• •

MPX2200DP

MPX2200AP

Tray 344B

• •

MPX2200AP

MPX2200GP

Tray 344B

• •

MPX2200GP

MPX2200

Series

0 to 200 kPa (0 to 29 psi)

40 mV Full Scale Span

(Typical)

UNIBODY PACKAGES

MPX2200A/D

CASE 344-15

MPX2200DP

CASE 344C-01

MPX2200AP/GP

CASE 344B-01

Application Examples

• Pump/Motor Control

• Robotics

• Level Detectors

• Medical Diagnostics

• Pressure Switching

• Barometers

• Altimeters

Summary of content (8 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX2200 Rev 13, 10/2008 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors MPX2200 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale Span (Typical) The MPX2200 series devices are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 200 kPa Supply Voltage(2) VS — 10 16 VDC Supply Current IO — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) VOFF -1.0 — 1.0 mV Sensitivity ΔV/ΔΡ — 0.2 — mV/kPa — -0.25 -1.0 — — 0.25 1.0 %VFSS Pressure Hysteresis(0 to 200 kPa) — — ±0.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Max Value Unit 800 kPa Storage Temperature –40 to +125 °C Operating Temperature –40 to +125 °C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2).
PAGE 4
Pressure On-Chip Temperature Compensation and Calibration VS = 10 VDC TA = 25°C P1 > P2 40 35 30 TYP Span Range (TYP) Output (mVDC) 25 MAX 20 15 MIN 10 5 0 kPa PSI -5 0 25 50 7.25 75 100 125 14.5 Pressure 150 21.75 175 Offset (TYP) 200 29 Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2200 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3.
PAGE 6
PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING.
PAGE 7
PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.
PAGE 8
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.